| http://www.w3.org/ns/prov#value | - However, material selection for the press plate 30 can be specifically tailored to meet process requirements by considering factors such as the range of applied pressures and the method of hardening the deformable layer, such as heat or radiation (UV, IR, etc.), as well as whether the surface of deformable layer 22 of the wafer 20 will be planar, curved or textured.
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