About: http://webisa.webdatacommons.org/35834347

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Such configuration achieves the semiconductor device 1 that includes a multilayer interconnect structure including the conductor interconnects 12, 22.The seal resin 50 is provided so as to cover the side face of the IC chip 30.
http://www.w3.org/ns/prov#wasQuotedFrom	patentgenius.com