About: http://webisa.webdatacommons.org/358422556

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Various techniques may be employed to cover the semiconductor chips with the electrically insulating material, for example compression molding, injection molding or lamination.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com