About: http://webisa.webdatacommons.org/360187358

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In general, the invention features stacked semiconductor assemblies in which a device such as a die, or a package, or a heat spreader is stacked over a first wire-bonded die.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au