About: http://webisa.webdatacommons.org/360248273

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, a filler such as metallic powder or polymer disposed among the pillars of the heterojunction heat conduction buffer layer can further improve thermal conduction.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com