| http://www.w3.org/ns/prov#value | - An excellent adhesion of the lowermost waterproof resin layer to a substrate such as paper or a synthetic paper can be secured by adjusting a melt-extruding temperature of the lowest layer to a usual temperature of 290??? C. to 345??? C., or by using an additive for improving the adhesion of the lowermost waterproof resin layer.
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