PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • More particularly, this invention relates to plasma etch processes useful in etching thick layers of silicon nitride for printhead cartridges, inkjet printers, surgical instruments, bio???medical devices and other articles where silicon nitride structures are shaped or formed.
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