| http://www.w3.org/ns/prov#value | - Various means are available for making such connections, for example, the interconnecting spacers described in the article entitled A 3-D System for Interconnection Meets the Challenge of High Density Packaging beginning on page 84 of the Apr., 1985 issue of Electronic Packaging and Production, stacking connectors made by suppliers such as Teledyne Kinetics, Solana Beach, Calif. and Cinch, Chica
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