About: http://webisa.webdatacommons.org/365030302

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Agent: Bond, Schoeneck & King, PLLC20090142532 - Method and apparatus for deploying a liquid metal thermal interface for chip cooling: In one embodiment, the present invention is a method and apparatus for chip cooling.
http://www.w3.org/ns/prov#wasQuotedFrom	freshpatents.com