| http://www.w3.org/ns/prov#value | - FIG. 22 shows a partially enlarged view of a composite of organic macromolecular synthetic resin and a metal according to another embodiment of the present invention, where numerals 1, 2 and 3 are identical with those in FIG. 1, and numeral 4 is a layer formed for enhancing the adhesiveness between the organic film as an insulating film and the metallic film as a conductor circuit.
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