| http://www.w3.org/ns/prov#value | - ic acid in a post clean treatment, but also describes the composition as useful for polishing copper, though the CMP compositions have no soluble metal ions; and U.S. Pat. No. 5,700,383 which describes a CMP composition containing an oxidant (water or H2O2), a fluoride salt, an abrasive, and a chelating agent, such as citric acid or ascorbic acid, but with no metal oxidizer.
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