| http://www.w3.org/ns/prov#value | - In particular, other substrate materials such as silicon or other types of support structures could be used besides those specified above, and a wide variety of materials could be used in device layers, insulating layers, leads, lines, electrodes, and other components; for example, a top coating of sputter deposited SiO or PECVD SiO or SiN could be provided.
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