About: http://webisa.webdatacommons.org/367629893

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The bumps 16 can be formed by a process such as electrodeposition or screen printing out of solderable alloy such as lead-tin, gold-tin, lead-silver-indium, or a solder wettable paste.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es