PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Attachments of the semiconductor devices 24a, 24c to either the hybrid circuit 42 or the die attach paddle 20 may be by any conventional means such as an epoxy or a low temperature melting solder.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com