| http://www.w3.org/ns/prov#value | - FIG. 6A is a schematic plan view of the SLED semiconductor chips 211 and some other components and FIG. 6B is a schematic cross sectional view taken along line 6B???6B in FIG. 6A. Referring to FIGS. 6A and 6B, slit 611 is filled with the silicone adhesive 511 that bond the base plate 212 and the aluminum support member 512 to each other.
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