About: http://webisa.webdatacommons.org/372290942

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Consequently, when there is a gap, both of the semiconductor chips are pressed against each other by the resin package 8, the pressure has to be absorbed only by the bump electrode portion, and it causes a problem as described above.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com