| http://www.w3.org/ns/prov#value | - In the process of the invention for producing the semiconductor device, the metal film 36 is provided on the surface of the semiconductor wafer 34 where the drive circuit 12 is formed on each semiconductor chip 16 and its provision is effected prior to processing steps such as sand blasting to form the ink channel 18 and open the ink supply holes 20 and dry etching to open the orifices 26.
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