| http://www.w3.org/ns/prov#value | - Furthermore, the heat-sealing substrate may be prepared by a so-called sandwich lamination method in which an anchoring agent such as mentioned above to the surface of the flexible substrate 6 and low density polyethylene or a copolymer of ethylene with an ethylenic monomer is extruded as an intermediate layer between the surface of the substrate 6 and a film 7 of the above-mentioned copolymer.
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