| http://www.w3.org/ns/prov#value | - U.S. Pat. No. 5,654,590 of Kuramochi for ???Multichip-Module Having an HDI and a Temporary Supporting Substrate??? starts with a bonding layer composed of a material such as silicon, aluminum or epoxy resin formed over a temporary supporting base with a temporary supporting layer composed of a material such as SiO2 or various glasses.
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