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Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	as illustrated, or alternatively may be made by other methods including solder bumps, tape automated bonding (TAB), conductive adhesives, flip chip or beam lead bonding.
http://www.w3.org/ns/prov#wasQuotedFrom	freepatentsonline.com