| http://www.w3.org/ns/prov#value | - An integrated circuit film 12 is electrically connected to a substrate 13 by a protruding electrode (bump) 15 therebetween in FIG. 1A. The integrated circuit film 12 is formed by peeling off a layer including TFTs formed over a glass substrate and wirings for driving the TFTs by a technique for transferring.
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