About: http://webisa.webdatacommons.org/374278685

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Although the C4 bonding process is usually employed to bond an IC chip to a module substrate, it can also be used to bond an IC chip directly to a mother board or other circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es