About: http://webisa.webdatacommons.org/375619115

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates generally to packaging semiconductor dies and more particularly to a method for packaging a semiconductor die containing one or more sensors and to a package resulting in particular from this method.
http://www.w3.org/ns/prov#wasQuotedFrom	google.ca