PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Then, the trench is filled with the metal film and the polysilicon film by planarizing the metal film 42 and the polysilicon film 40 using a planarizing process such as an etch back process or chemical mechanical polishing (CMP).
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com