| http://www.w3.org/ns/prov#value | - When a buffer layer is to be formed by physical vapor deposition, physical vapor deposition is performed preferably at 200-600??? C., more preferably 300-500??? C., most preferably 350-450??? C. When physical vapor deposition, such as sputtering, is employed, the thickness of a buffer layer is preferably 100-3000 angstroms, more preferably 100-500 angstroms, most preferably 100-300 angstroms.
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