About: http://webisa.webdatacommons.org/378315311

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Insulation material, such as SiO2, SiOx, SiN, FSG, BPSG, BSG, low-k material, or other suitable dielectric material is deposited over exposed portions of preprocessed wafer 220 and bottom contact 232.
http://www.w3.org/ns/prov#wasQuotedFrom	freepatentsonline.com