| http://www.w3.org/ns/prov#value | - a ceramic substrate; a plurality of metal circuit plates bonded to a surface of said ceramic substrate; and parts including semiconductor element integrally bonded to a surface of said. metal circuit plates through a solder layer, wherein at least a peripheral portion of one metal circuit plate to which said parts are solder-bonded and is adjacent to the other metal circuit plates is formed with a
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