| http://www.w3.org/ns/prov#value | - ayer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrateUS5552631 *20 Dic 19933 Sep 1996Lsi Logic CorporationSemiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor dieUS56
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