| http://www.w3.org/ns/prov#value | - Patent US7682873 - Semiconductor multi-package module having package stacked over die-down flip ... - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More ??Sign inAdvanced Patent SearchPatentsA semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interc
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