| http://www.w3.org/ns/prov#value | - as that shown in FIG. 5 except that the inner portion of the electrolytic bath tank T at the lower part of FIG. 5 is replaced by the polishing apparatus shown in FIG. 18. [0346] Namely, a wafer W comprised of a substrate 101 formed with an interconnection layer 105 as the surface to be polished is secured by a securing means such as a vacuum chuck, an edge clamp, or a mechanical clamp and is drive
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