| http://www.w3.org/ns/prov#value | - abushiki KaishaPacked semiconductor device with wrap around external leadsUS5838061Nov 18, 1996Nov 17, 1998Lg Semicon Co., Ltd.Semiconductor package including a semiconductor chip adhesively bonded theretoUS5861666Aug 29, 1996Jan 19, 1999Tessera, Inc.Multiple semiconductor chip assemblyUS5883426Apr 18, 1997Mar 16, 1999Nec CorporationStack moduleUS6075289 *Nov 4, 1996Jun 13, 2000Tessera, Inc.Therma
|
