| http://www.w3.org/ns/prov#value | - Namely, where a chip is mounted on only one side of a core substrate with an adhesive in a mount mode such as shown in FIG. 9, a package may warp due to the difference in thermal expansion coefficients among the chip, the core substrate, and their surrounding build-up layers; however, warpage of the package can be effectively suppressed by mounting the chips 30 and 40 on both surfaces of the core
|
