| http://www.w3.org/ns/prov#value | - Patent US7550386 - Advanced seed layers for interconnects - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More ??Sign inAdvanced Patent SearchPatentsOne embodiment of the present invention is a method for making metallic interconnects over a substrate, the substrate having a patterned insulating layer which includes at least one opening and a field surrounding the at least one ope
|
