| http://www.w3.org/ns/prov#value | - BACKGROUND OF THE INVENTION [0001] (a) Field of the Invention [0002] The present invention generally relates to cutting of a substrate, and more particularly to apparatus and method for cutting a brittle object such as a glass substrate for use of an LCD panel using a laser. [0003] (b) Description of the Related Art [0004] Liquid crystal display (LCD) devices are a well known form of flat panel di
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