| http://www.w3.org/ns/prov#value | - FIGS. 11 and 12 are a plan and sectional elevation views of a portion of a multi-layer printed circuit board (PCB) 70 employing a prior art conductive via 72 in accordance with the invention to link a stripline conductor 74 formed on a buried layer of PCB 70 to a stripline conductor 78 formed on another buried layer of the PCB. Via 72 includes an upper annular ring 82, a lower annular ring 84, a v
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