| http://www.w3.org/ns/prov#value | - 7C, and FIG. 8D). [0231] Next, by totally the same method as used in the first embodiment, contact holes 56, 62, and 65 are formed in the passivation film 54 (see FIG. 23H, FIG. 7D, and FIG. 8E). [0232] Then, a metal film having a high melting point such as Cr or Mo and having a thickness of 50 nm to 200 nm and Al???Nd alloy film having a thickness of 100 nm to 300 nm are sequentially formed by sp
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