| http://www.w3.org/ns/prov#value | - Patent US5173442 - Masking, etching insulation; copper-polyimide substrate - Google PatenteSuche Bilder Maps Play YouTube News Gmail Drive Mehr ??Anmelden Erweiterte Patentsuche PatenteChannels extending partially through and vias extending completely through an insulating layer in an electrical interconnect such as a substrate or integrated circuit can be formed in a relatively few steps with low
|
