| http://www.w3.org/ns/prov#value | - 378657Mar 4, 1994Jan 3, 1995Motorola, Inc.Method for making an aluminum clad leadframe and a semiconductor device employing the sameUS5391918 *Jun 24, 1993Feb 21, 1995Kabushiki Kaisha ToshibaSemiconductor deviceUS5391923 *Oct 14, 1993Feb 21, 1995Mitsubishi Denki Kabushiki KaishaTape carrier including leads on both sides and resin-encapsulated semiconductor device incorporating the tape carrierUS53
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