| http://www.w3.org/ns/prov#value | - g optical microlenses, electrical bump bonds, and electrical bonds between mutually perpendicular chips. [0005] The present invention particularly concerns the precision fabrication of, inter alia, (i) high performance transparent polymer optical microlenses and microlens arrays, including as may be either arrayed or aligned, including self-aligned, to the ends of optical fibers, and, separately b
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