| http://www.w3.org/ns/prov#value | - Therefore, there has been employed what is called Damascene method in which copper or a thin film of copper alloy is accumulated on and embedded in an insulating film by way of a groove formed in advance on the insulating film and then the copper or the copper alloy thin film remaining at the portions other than the groove portion is removed by CMP, whereby embedded wiring is formed.
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