About: http://webisa.webdatacommons.org/383337075

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates to integrated circuit device packaging, and more specifically, to an interposer substrate for interconnecting integrated circuit chips to a printed circuit board or other substrate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com