About: http://webisa.webdatacommons.org/38376698

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The inventive polishing pad is preferably used for planarizing semiconductor wafers or other substrates with a mechanical or CMP process.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es