| http://www.w3.org/ns/prov#value | - The polyimide photoresist 104 used in an embodiment of the present invention has been shown to have excellent adhesion to various metals such as silicon (Si), silicon oxide (SiO2), silicon nitride (SiN), aluminum (Al), aluminum oxide (Al2O3), copper (Cu), titanium (Ti), and nickel vanadium alloy (NiV).
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