| http://www.w3.org/ns/prov#value | - Additional materials, such as polymers, that may be suitable for use in the present invention are described in the patent literature: U.S. Pat. No., 5,919,234 to Lemperle, issued Jul. 6, 1999; U.S. Pat. No. 5,935,594, issued to Ringeisen et al., issued Aug. 10, 1999; U.S. Pat. No. 5,935,594 to Ringeisen et al., issued Aug. 10, 1999; U.S. Pat. No. 5,876,452 to Athanasiou et al., issued Mar. 2, 1999
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