| http://www.w3.org/ns/prov#value | - FIG. 8 depicts an alternative system 10A which comprises a pair of vacuum pump systems 12--12 situated on opposite sides of the vacuum sputtering chamber, a plurality of devices 26 for depositing material such as silicon and devices 27 for depositing material such as tantalum, on the inside of the drum 14 facing outwardly and interspersed oxidizing or other reaction devices 28 situated on the outs
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