PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The device of claim 12 wherein said metal bonding pad layer has a composition including 0.5 to 2% silicon about 0.5% copper and aluminum.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.fr