| http://www.w3.org/ns/prov#value | - diate layer 104a through a high-frequency sputtering method using Ar as an introduced gas and Ta.sub.2O.sub.5 or the like as a target.Moreover, the intermediate layer 104 in the present embodiment was a two-layer structure, but in the case of having the properties described above, i.e. properties of it being possible to prevent the occurrence of causes of the alkali resistanceand the adhesion drop
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