| http://www.w3.org/ns/prov#value | - d making temporary (e.g., resilient) connection to a test board, such as for test and burn-in, according to the present invention. [0138]FIG. 13B is a side view of the semiconductor package of FIG. 13A making permanent (e.g., soldered) connection to a printed circuit board, according to the present invention. [0139] FIGS. 14A-14E are side views of a technique for mounting resilient contact structu
|
