| http://www.w3.org/ns/prov#value | - d pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesUS7462940Jan 8, 2007Dec 9, 2008Infineon Technologies AgSemiconductor component comprising flip chip contacts with polymer cores and method of producing the sameUS7784670 *Jan 21, 2005Aug 31, 2010Bondtech Inc.Joining method and device produced by this m
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