About: http://webisa.webdatacommons.org/386617044

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Finally, the process for sawing the wafer is a process for separating each semiconductor die (the controller 130 or the flash memory 140) to each piece using a diamond blade wb, etc.
http://www.w3.org/ns/prov#wasQuotedFrom	google.ca